Figure 1 shows the Cu concentration (in atomic %) of the deposited NiCu films as a function of the corresponding Cu concentration in the deposition solution.

Each point in the graph represents a single sample, and the error bars are the learn more typical uncertainty for the EDS measurements. The dashed line indicates the case that the film composition is equal to the solution composition. At the deposition potential of -1,200 mV, the deposition rates for both Ni and Cu are essentially diffusion-controlled, so the composition of the films track the composition of the solutions to a large extent. However, Selleckchem GDC0449 there is some variation in the results from sample to sample, reflecting a degree of variability in the experimental setup. Figure 1 Copper composition in electrodeposited NiCu thin films. Copper composition in the electrodeposited films as determined by EDS as a function of the copper composition in the deposition solution. Each point represents a single sample, and the error bars are IWP-2 manufacturer the typical

EDS uncertainty. The dashed line indicates equal composition in the solution and in the film. The effect of the dealloying procedure on the Cu content of the samples is shown in Figure 2, where the Cu composition after dealloying is compared to the composition in the as-deposited films. Again, each point represents a single sample,

and the error bars indicate the typical uncertainty for the EDS measurements. The dashed line indicates no net change in the Cu composition, that is, removal of both species at identical rates. Over the range of Cu concentrations studied, one of two outcomes was achieved. Either both species were removed at the same rate, so that statistically Phospholipase D1 the post-dealloy Cu composition did not change, or Cu was selectively removed, leading to a decrease in the Cu composition. For higher initial Cu concentrations, copper was selectively removed. However, for the LSV dealloying procedure used, there is evidence of a lower limit to the Cu removal, resulting in samples with about 12% Cu. Figure 2 Copper composition in dealloyed NiCu thin films. Copper composition in the dealloyed films as a function of the composition in the as-deposited film. Each point represents a single sample, and the error bars are the typical EDS uncertainty. The dashed line indicates removal of both components at equal rates. The structure of the as-deposited and dealloyed NiCu samples was characterized using SEM. Example SEM images of the NiCu films are shown in Figure 3 both before (a, c, e) and after (b, d, f) the dealloying procedure. As the initial copper content in the film increases (from a to c to e), the grain size and roughness of the as-deposited film increases slightly.